Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860SRZQ80D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. Advanced packaging method Tray is used to provide high reliability. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Recognize operating temperatures around 0°C~95°C TA. In the MPC8xx series, it is found. This CPU uses DRAM RAM controllers. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces are designed to serve users better. This CPU runs I/O at 3.3V. To find variants of the microprocessor, try searching with MPC860.
KMPC860SRZQ80D4 Features
KMPC860SRZQ80D4 Applications
There are a lot of NXP USA Inc. KMPC860SRZQ80D4 Microprocessor applications.
- 3D printers
- Heart rate monitors
- Speed meter
- Mice
- Automobile
- Torpedo guidance
- Firewalls
- Entertainment products
- Food and beverage
- Pacemakers (used to control abnormal heart rhythm)