Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860TCVR50D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved by using advanced packaging methods Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Understand how the operating temperature around -40°C~95°C TA is determined. In the MPC8xx series, it is found. A CPU with this architecture uses DRAM RAM controllers. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. The CPU runs I/O at 3.3V. Use MPC860 to search for variants of the cpu microprocessor.
KMPC860TCVR50D4 Features
KMPC860TCVR50D4 Applications
There are a lot of NXP USA Inc. KMPC860TCVR50D4 Microprocessor applications.
- Digital cameras
- Entertainment products
- Agriculture, transportation field
- Mobile computers
- Smartphone
- Hearing aids
- Speed meter
- Virtual reality VR robots
- Fire alarms
- Blood pressure monitors