Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
KMPC860TCVR66D4 Overview
With a packing size of 357-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is provided by the advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. The operating temperature around -40°C~95°C TA should be understood. This is part of the MPC8xx series. This CPU uses DRAM RAM controllers. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces. In this CPU, I/O is set to 3.3V. If you are looking for variants of the cpu microprocessor, try search with MPC860.
KMPC860TCVR66D4 Features
KMPC860TCVR66D4 Applications
There are a lot of NXP USA Inc. KMPC860TCVR66D4 Microprocessor applications.
- Walkie talkies
- Kindle
- Answering machines
- Copiers
- Nintendo
- Washing machine
- Printers
- Home video and audio
- Entertainment-radios, CD players, televisions
- Fire detection & safety devices