Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860TCZQ50D4 Overview
The microprocessor is conveniently packaged in 357-BBGA, making it easy to ship internationally. Using advanced packaging techniques Tray, high reliability is ensured. The CPU has 1 Core 32-Bit cores/Bus width. Understand how the operating temperature around -40°C~95°C TA is determined. This is a member of the MPC8xx series. The CPU uses DRAM RAM controllers. With its HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. In this CPU, I/O is set to 3.3V. You can search for variants of a microprocessor with MPC860.
KMPC860TCZQ50D4 Features
KMPC860TCZQ50D4 Applications
There are a lot of NXP USA Inc. KMPC860TCZQ50D4 Microprocessor applications.
- Answering machines
- Walkie talkies
- Consumer electronics products
- Industrial instrumentation devices
- Blenders
- Digital cameras
- Home video and audio
- Hard drives
- Paper shredders
- Gas monitoring systems