Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC860 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (4), 10/100Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
KMPC860TCZQ66D4 Overview
The embedded microprocessor has been packed in 357-BBGA for convenient overseas shipping. High reliability is achieved by using advanced packaging methods Tray. The CPU has 1 Core 32-Bit cores/Bus width. Be aware of the operating temperature around -40°C~95°C TA. This is part of the MPC8xx series. There are DRAM RAM controllers used by this CPU. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces are designed to serve users better. There is 3.3V I/O running on this CPU. You can search for variants of a microprocessor with MPC860.
KMPC860TCZQ66D4 Features
KMPC860TCZQ66D4 Applications
There are a lot of NXP USA Inc. KMPC860TCZQ66D4 Microprocessor applications.
- Playstation
- Office automation equipment and computer peripherals
- Smart highways (navigation, traffic control, information monitoring and car service)
- Radio
- Computer/laptop
- Equipment control
- Ipad
- Hand-held metering systems
- Blenders
- Oil and gas