Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
-40°C~100°C TA |
Packaging |
Tray |
Published |
2003 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC875 |
Speed |
133MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM, Security; SEC |
Security Features |
Cryptography |
RoHS Status |
Non-RoHS Compliant |
KMPC875CZT133 Overview
Due to its 256-BBGA packaging, it is convenient to ship overseas. High reliability is achieved using advanced packaging method Tray. The CPU has 1 Core 32-Bit cores/Bus width. Understand the operating temperature around -40°C~100°C TA. The cpu microprocessor belongs to the MPC8xx series. Memory controllers for this CPU are DRAM. The microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART for better service. 3.3V is the I/O speed of this CPU. The microprocessor can be searched for with MPC875 if you are looking for variants.
KMPC875CZT133 Features
KMPC875CZT133 Applications
There are a lot of NXP USA Inc. KMPC875CZT133 Microprocessor applications.
- DDC control
- Kindle
- Information appliances (networking of household appliances)
- Accu-check
- 3D printers
- Electronic jamming systems
- Magnetic resonance imaging (MRI)
- Security systems
- Tape drives
- Safety field