Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
-40°C~100°C TA |
Packaging |
Tray |
Published |
2003 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC875 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM, Security; SEC |
Security Features |
Cryptography |
RoHS Status |
Non-RoHS Compliant |
KMPC875CZT66 Overview
With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Recognize operating temperatures around -40°C~100°C TA. MPC8xx is its series number. A total of DRAM RAM controllers are used by this CPU. With its HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces, this microprocessor will be able to serve you better. 3.3V is the I/O speed of this CPU. Search MPC875 for variants of the embedded microprocessor.
KMPC875CZT66 Features
KMPC875CZT66 Applications
There are a lot of NXP USA Inc. KMPC875CZT66 Microprocessor applications.
- Printers
- Traditional industrial transformation
- Blenders
- Sonography (Ultrasound imaging)
- Equipment control
- Metering & measurement field
- Process control devices
- Kindle
- Safety -airbags, automatic braking system (ABS)
- Safety field