Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2003 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC875 |
Speed |
133MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1), 10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM, Security; SEC |
Security Features |
Cryptography |
RoHS Status |
ROHS3 Compliant |
KMPC875VR133 Overview
The embedded microprocessor has been packed in 256-BBGA for convenient overseas shipping. High reliability can be achieved by using the advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand the operating temperature around 0°C~95°C TA. A MPC8xx series item. This CPU uses DRAM RAM controllers. This microprocessor has HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART interfaces to serve you better. The CPU runs I/O at 3.3V. Use MPC875 when searching for variants of the embedded microprocessor.
KMPC875VR133 Features
KMPC875VR133 Applications
There are a lot of NXP USA Inc. KMPC875VR133 Microprocessor applications.
- Playstation
- Metering & measurement field
- Robotic prosthetic limbs
- Television
- Electrocardiogram (EKG)
- Washing machine
- Xbox
- Home video and audio
- Entertainment products
- Oil and gas