Parameters |
Package / Case |
357-BBGA |
Operating Temperature |
-40°C~100°C TA |
Packaging |
Tray |
Published |
2002 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
MPC885 |
Speed |
133MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (3), 10/100Mbps (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 2.0 (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM, Security; SEC |
Security Features |
Cryptography |
RoHS Status |
ROHS3 Compliant |
KMPC885CVR133 Overview
Due to its 357-BBGA packaging, it is convenient to ship overseas. High reliability is achieved using advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand how the operating temperature around -40°C~100°C TA is determined. In the MPC8xx series, it is found. There are DRAM RAM controllers on this CPU. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART. In this CPU, I/O is set to 3.3V. Use MPC885 to search for variants of the cpu microprocessor.
KMPC885CVR133 Features
KMPC885CVR133 Applications
There are a lot of NXP USA Inc. KMPC885CVR133 Microprocessor applications.
- Smartphone
- Digital set-top boxes
- Metering & measurement field
- Industrial instrumentation devices
- Glucose monitoring systems (for Type 1 Diabetes)
- Fabric
- Entertainment products
- Leakage current tester
- Information appliances (networking of household appliances)
- Sonography (Ultrasound imaging)