LAMXO640C-3FTN256E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~125°C TA |
| Packaging | Tray |
| Published | 2009 |
| Series | LA-MachXO |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LAMXO640 |
| Pin Count | 256 |
| Number of Outputs | 159 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.3V |
| Programmable Type | In System Programmable |
| Max Supply Voltage | 3.465V |
| Min Supply Voltage | 1.71V |
| Memory Size | 768B |
| Number of I/O | 159 |
| Nominal Supply Current | 17mA |
| Memory Type | SRAM |
| Clock Frequency | 25MHz |
| Propagation Delay | 4.9 ns |
| Number of Logic Elements/Cells | 640 |
| Screening Level | AEC-Q100 |
| Number of Logic Blocks (LABs) | 80 |
| Output Function | MACROCELL |
| Number of Macro Cells | 320 |
| Number of Logic Cells | 640 |
| Voltage Supply - Internal | 1.71V~3.465V |
| Delay Time tpd(1) Max | 4.9ns |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LAMXO640C-3FTN256E Overview
This network has 320macro cells, which are cells that provide radio coverage provided by a high-power cell site (tower, antenna, mast).A 256-LBGA package contains the item.In this case, there are 159 I/Os programmed.There is a 256terminations set on devices.The terminal position of this electrical component is BOTTOM.The power source is powered by 1.8Vvolts.There is a part in the family [0].Trayshould be used to package the chip.Due to its reliability, it is operated at a temperature of [0].It is recommended that Surface Mountholds the chip in place.In terms of FPGAs, it belongs to the LA-MachXO series.The chip is programmed with 256 pins.The LAMXO640indicates that its related parts can be found.For high efficiency, the supply voltage should be maintained at [0].SRAM is adopted for storing data.The electronic component is mounted by Surface Mount.There are 256 pins on the device.With a maximum supply voltage of [0], it operates.The minimal supply voltage is 1.71V.It is composed of 80 logic blocks (LABs).There are 640 logic elements/cells on the device.The clock frequency of this device should not exceed 25MHz.Devices are equipped with a memory capacity of 768Bfor storing programs and data.This device is configured with a 159 output.
LAMXO640C-3FTN256E Features
256-LBGA package
159 I/Os
The operating temperature of -40°C~125°C TA
256 pin count
256 pins
80 logic blocks (LABs)
159 outputs
LAMXO640C-3FTN256E Applications
There are a lot of Lattice Semiconductor Corporation LAMXO640C-3FTN256E CPLDs applications.
- Custom state machines
- ON-CHIP OSCILLATOR CIRCUIT
- Parity generators
- High speed graphics processing
- Voltage level translation
- Synchronous or asynchronous mode
- Portable digital devices
- Programmable power management
- D/T registers and latches
- Software-Driven Hardware Configuration
