LC5512MV-75F256C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~90°C TJ |
| Packaging | Tray |
| Published | 2000 |
| Series | ispXPLD® 5000MV |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| Additional Feature | YES |
| HTS Code | 8542.39.00.01 |
| Subcategory | Programmable Logic Devices |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 3.3V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Frequency | 200MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LC5512 |
| Pin Count | 256 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.3V |
| Programmable Type | In System Programmable |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 3V |
| Operating Supply Current | 33mA |
| Number of I/O | 193 |
| Nominal Supply Current | 33mA |
| RAM Size | 32kB |
| Memory Type | EEPROM, SRAM |
| Propagation Delay | 7.5 ns |
| Output Function | MACROCELL |
| Number of Macro Cells | 512 |
| JTAG BST | YES |
| Voltage Supply - Internal | 3V~3.6V |
| Number of Logic Elements/Blocks | 16 |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Lead Free |
LC5512MV-75F256C Overview
A mobile phone network consists of 512macro cells, which are radio coverage cells served by a high-power cell site (tower, antenna or mast).It is part of the 256-BGA package.It is programmed with 193 I/Os.It is programmed that device terminations will be 256 .There is a BOTTOMterminal position on the electrical part in question.A voltage of 3.3V is used as the power supply for this device.This part is part of the family [0].It is recommended that the chip be packaged by Tray.In order to ensure the reliability of the device, it is designed to operate at a temperature of [0].It is recommended to mount the chip by Surface Mount.FPGAs belonging to the ispXPLD? 5000MVseries contain this type of chip.It is equipped with 256 pin count.This device can also display [0].There are related parts in [0].Optimal efficiency requires a supply voltage of [0].It is recommended to store data in [0].This device is mounted by Surface Mount.There are 256 pins on the device.In this case, the maximum supply voltage is 3.6V.A minimum supply voltage of 3V is required for it to operate.There are 16 logic elements/blocks, which are fundamental building blocks of field-programmable gate array (FPGA) technology.This frequency can be achieved at 200MHz.
LC5512MV-75F256C Features
256-BGA package
193 I/Os
The operating temperature of 0°C~90°C TJ
256 pin count
256 pins
LC5512MV-75F256C Applications
There are a lot of Lattice Semiconductor Corporation LC5512MV-75F256C CPLDs applications.
- PLC analog input modules
- Dedicated input registers
- Digital multiplexers
- Protection relays
- White goods (Washing, Cold, Aircon ,...)
- Code converters
- USB Bus
- Reset swapping
- LED Lighting systems
- Multiple DIP Switch Replacement
