Parameters |
Mount |
Surface Mount |
Package / Case |
FCBGA |
Number of Pins |
1284 |
Max Operating Temperature |
105°C |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Max Supply Voltage |
1.3625V |
Min Supply Voltage |
850mV |
Memory Size |
16GB |
Number of I/O |
38 |
Memory Type |
DDR2 |
Data Bus Width |
64b |
Boundary Scan |
NO |
Bus Compatibility |
PCI; SATA; SMBUS; UART; USB |
Length |
40mm |
Width |
40mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
LE3100MICHSL9PU Overview
The embedded microprocessor ships overseas conveniently packed in FCBGA. Detailed functions for 1284 pins can be found in the datasheets. To transfer data, there are 64b bandwidths available. The microprocessor should not operate in an environment where the temperature is higher than 105°C. In many applications, this CPU is mounted with a Surface Mount bus. normally, the microprocessor should not receive a voltage higher than 1.3625V. The lowest voltage that should be applied to the micro processor is 850mV. Data is transferred through 38 I/O ports by CPU programs. CPU memory is sized 16GB.
LE3100MICHSL9PU Features
64b-Bit Data Bus Width
38 I/Os
LE3100MICHSL9PU Applications
There are a lot of Intel LE3100MICHSL9PU Microprocessor applications.
- Smartphone
- Network application field
- Christmas lights
- Safety -airbags, automatic braking system (ABS)
- Auto-breaking system
- Switches
- Metering & measurement field
- Broadband technology, video and voice processing
- Oil and gas
- Communication-bluetooth, Wi-Fi, radio