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LE57D122BTC

44 Terminations5V Telecom device2 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-LE57D122BTC
  • Package: 44-TQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 195
  • Description: 44 Terminations5V Telecom device2 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 44-TQFP Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tray
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 44
Terminal Finish Matte Tin (Sn)
Voltage - Supply 4.75V~5.25V
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 5V
Terminal Pitch 0.8mm
JESD-30 Code S-PQFP-G44
Function Subscriber Line Interface Concept (SLIC)
Qualification Status Not Qualified
Operating Supply Voltage 5V
Interface 2-Wire
Number of Circuits 2
Operating Supply Current 9.3mA
Length 10mm
Width 10mm
RoHS Status ROHS3 Compliant

LE57D122BTC Overview


A 44-TQFP Exposed Pad package is used to reduce board space requirements.To pack telecommunications equipment, the way of Tray is used.Telecommunications equipment is mounted using Surface Mount.This telecom IC is composed of 2 circuits.When 4.75V~5.25V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom switching is mounted in the way of Surface Mount.In telecom switching configuration, 44 terminations are present.The supply voltage it operates with is 5V.With the voltage of 5V as its supply voltage, designers have a great deal of flexibility.Designers have a great deal of flexibility with this telecom circuit due to its operation with the supply current provided by 9.3mA.

LE57D122BTC Features


Available in the 44-TQFP Exposed Pad package
Operating supply voltage of 5V
Operating supply current of 9.3mA

LE57D122BTC Applications


There are a lot of Microchip Technology LE57D122BTC Telecom applications.

  • Stations
  • T3 channelized access concentrators
  • Fiber
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • M13 MUX
  • Network Multiplexing and Terminating Equipment
  • Integrated Access Devices
  • Add/Drop multiplexers (ADMs)
  • Digital Cross-Connect Systems
  • Router

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