Parameters |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Number of Pins |
20 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tube |
JESD-609 Code |
e3 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
20 |
Terminal Finish |
MATTE TIN |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Supply Voltage |
5V |
Function |
Line Card Access Switch |
Qualification Status |
Not Qualified |
Number of Circuits |
1 |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
2.65mm |
Width |
7.5mm |
RoHS Status |
RoHS Compliant |
LE75183BDSC Overview
To save board space, the 20-SOIC (0.295, 7.50mm Width) package is used.For telecommunications equipment packing, the Tube method is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits are used in this telecom IC .Improved efficiency can be ensured when the supply voltage of 4.5V~5.5V is provided.Using -40°C~85°C as the operating temperature can result in reliable performance.The mounting is in the way of Surface Mount.Configuration of this telecom circuit has 20 terminations.5V is its supply voltage.The telecom interface contains 20 pins.TELECOM CIRCUIT is the type of IC it uses for telecom.
LE75183BDSC Features
Available in the 20-SOIC (0.295, 7.50mm Width) package
TELECOM CIRCUIT as telecom IC type
LE75183BDSC Applications
There are a lot of Microsemi Corporation LE75183BDSC Telecom applications.
- T1/E1/J1 Multiplexer and Channel Banks
- E3/DS3 Access Equipment
- Multiplexers
- SDH Multiplexers
- E1 LAN/WAN Routers
- Interfaces to SONET STS-1 Networks
- PCM Test Equipment
- Digital loop carrier (DLC)
- Channel Banks
- DSLAMs