Parameters |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
20-SOIC (0.295, 7.50mm Width) |
Number of Pins |
20 |
Operating Temperature |
-40°C~85°C |
Packaging |
Tape & Reel (TR) |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
20 |
Voltage - Supply |
4.5V~5.5V |
Terminal Position |
DUAL |
Terminal Form |
GULL WING |
Supply Voltage |
5V |
Function |
Line Card Access Switch |
Number of Circuits |
1 |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
2.65mm |
Width |
7.5mm |
Radiation Hardening |
No |
RoHS Status |
ROHS3 Compliant |
LE75183CDSCT Overview
A 20-SOIC (0.295, 7.50mm Width) package is used to reduce board space requirements.Telecommunications equipment is packed using the Tape & Reel (TR) method.Telecommunications equipment is mounted with type Surface Mount.Telecom circuit is made up of 1 circuits.Telecom circuit is possible to increase efficiency by providing 4.5V~5.5V with a higher voltage.A -40°C~85°C-temperature setting offers reliable performance.Telecom switching is mounted in the way of Surface Mount.20 terminations can be found in the configuration.It operates with a voltage of 5V.An interface with 20 pins is present on this telecom interface.As its telecom IC type, it uses TELECOM CIRCUIT.
LE75183CDSCT Features
Available in the 20-SOIC (0.295, 7.50mm Width) package
TELECOM CIRCUIT as telecom IC type
LE75183CDSCT Applications
There are a lot of Microchip Technology LE75183CDSCT Telecom applications.
- E1 Multiplexer
- CSU/DSU E1/T1/J1 Interface
- Multi-Line E1 Interface Cards
- Intelligent PBX
- CSU/DSU Equipment
- High-Density T1/E1/J1 interfaces for Multiplexers
- DSLAMs
- Digital Cross Connect Systems
- Cable PC
- Interfaces to E3