LE79114KVC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 128-TQFP |
| Supplier Device Package | 128-TQFP |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V |
| Interface | PCM |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
LE79114KVC Overview
Saving board space is achieved with the 128-TQFP package.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.When the voltage for 3.3V is provided, improved efficiency can be achieved.Mounted in Surface Mount-direction.
LE79114KVC Features
Available in the 128-TQFP package
LE79114KVC Applications
There are a lot of Microchip Technology LE79114KVC Telecom applications.
- Integrated Access Devices (IADs)
- Central office
- E1 LAN/WAN Routers
- Digital Modems
- Digital loop carrier (DLC)
- CSU/DSU Equipment
- Channel Banks
- Fiber in the loop (FITL)
- Wireless local loop (WLL)
- Routers
