LE79234KVC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 128-TQFP |
| Supplier Device Package | 128-TQFP |
| Packaging | Tray |
| Published | 2011 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Interface | 2-Wire |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
LE79234KVC Overview
To save board space, the 128-TQFP package is used.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.Telecom switching is mounted in a Surface Mount-direction.
LE79234KVC Features
Available in the 128-TQFP package
LE79234KVC Applications
There are a lot of Microchip Technology LE79234KVC Telecom applications.
- Wireless base stations
- PCM channel bank
- High-Density T1/E1/J1 interfaces for Multiplexers
- E1 Multiplexer
- ISDN Primary Rate Interfaces (PRA)
- Remote wireless modules
- Channel Banks
- E3/DS3 Access Equipment
- PDH Multiplexers
- ISDN NT1/TA
