Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Contact Plating |
Tin |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
80-LQFP |
Number of Pins |
80 |
Supplier Device Package |
80-eLQFP |
Weight |
639.990485mg |
Packaging |
Tray |
Published |
2008 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Voltage - Supply |
4.75V~35V |
Function |
Telecom Circuit |
Number of Channels |
2 |
Interface |
PCM |
Number of Circuits |
2 |
Max Supply Voltage |
35V |
Min Supply Voltage |
4.75V |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LE88276DLC Overview
To save board space, the 80-LQFP package is used.For telecommunications equipment packing, the Tray method is used.Surface Mount is used as telecommunications equipment mounting type.This telecom IC is composed of 2 circuits.Wtelecom IC's efficiencyh a high supply voltage, 4.75V~35V can be operated more efficiently.The mounting is in the way of Surface Mount.The telecom interface contains 80 pins.At least 4.75V voltage should be supplied.35V should be lower than the voltage supplied.Using 2 channels, it achieves its superior flexibility.
LE88276DLC Features
Available in the 80-LQFP package
LE88276DLC Applications
There are a lot of Microchip Technology LE88276DLC Telecom applications.
- NIU
- T1/E1/J1 add/drop multiplexers (MUX)
- Digital access cross connects
- Intelligent PBX
- DECT (Digital European Cordless Telephone) Base Stations
- E1 LAN/WAN Routers
- ATM Switches
- Inverse Multiplexing for ATM (IMA)
- Interfaces to SONET STS-1 Networks
- T1/E1/J1 Performance Monitoring