LE88506DVC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | TQFP |
| Number of Pins | 64 |
| Supplier Device Package | 64-TQFP (10x10) |
| Weight | 360.605934mg |
| Packaging | Tray |
| Published | 2008 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Voltage - Supply | 3.3V~35V |
| Function | Telecom Circuit |
| Number of Channels | 2 |
| Interface | PCM |
| Number of Circuits | 2 |
| Max Supply Voltage | 35V |
| Min Supply Voltage | 3.3V |
| RoHS Status | ROHS3 Compliant |
LE88506DVC Overview
Board space can be saved by using the TQFP package.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 2 circuits.When 3.3V~35V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A Surface Mount-axis mounts telecom switching.There are 64 pins on this telecom interface.The voltage supplied should be 3.3V at least.There should be a lower voltage supplied than 35V.Using 2 channels, it achieves its superior flexibility.
LE88506DVC Features
Available in the TQFP package
LE88506DVC Applications
There are a lot of Microchip Technology LE88506DVC Telecom applications.
- Public switching systems
- Home Gateway
- Integrated Access Devices
- SDH/SONET multiplexers
- Cross Connects
- Interfaces to DS3
- Integrated Multi-Service Access Platforms (IMAPs)
- Cable PC
- T1 Digital Cross Connects (DSX-1)
- M13 MUX
