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LE89116QVC

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-LE89116QVC
  • Package: LQFP
  • Datasheet: -
  • Stock: 520
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case LQFP
Supplier Device Package 48-LQFP
Weight 181.692094mg
Packaging Tray
Published 2010
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Channels 1
Interface PCM
Number of Circuits 1
RoHS Status ROHS3 Compliant

LE89116QVC Overview


LQFP package is used to save board space.Telecommunications equipment is packed using the Tray method.Surface Mount is used as telecommunications equipment mounting type.The telecom IC is composed of 1 circuits.Using 1 channels, it achieves its superior flexibility.

LE89116QVC Features


Available in the LQFP package

LE89116QVC Applications


There are a lot of Microchip Technology LE89116QVC Telecom applications.

  • Router
  • Fiber Optic Terminals
  • T3 channelized access concentrators
  • Channel Service Units (CSUs): T1/E1/J1
  • Public switching systems
  • Intelligent PBX
  • Short/Medium Loop
  • CSU/DSU E1 Interface
  • Multiplexers
  • E2 Rates PCM Line Interface

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