LE89810BSC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | SOIC |
| Supplier Device Package | 16-SOIC |
| Weight | 665.986997mg |
| Packaging | Tube |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Max Power Dissipation | 120mW |
| Number of Channels | 2 |
| Interface | PCM |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
LE89810BSC Overview
To save board space, the SOIC package is used.To pack telecommunications equipment, the way of Tube is used.Telecommunications equipment is mounted using Surface Mount.An 1-circuit makes up this telecom IC .A Surface Mount-axis mount is used.The superior flexibility of the telecom IC is achieved by using 2 channels.
LE89810BSC Features
Available in the SOIC package
LE89810BSC Applications
There are a lot of Microchip Technology LE89810BSC Telecom applications.
- Fiber Optic Terminals
- Fiber In The Loop (FITL)
- Channel Banks
- E1 Multiplexer
- E1 Rates PCM Line Interface
- T1 Digital Cross Connects (DSX-1)
- Digital access cross connects
- Public switching systems
- ISDN NT1/TA
- BITS Timing
