LFE2-12E-6FN256I
| Parameters | |
|---|---|
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | ECP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2-12 |
| Pin Count | 256 |
| Number of Outputs | 193 |
| Operating Supply Voltage | 1.2V |
| Memory Size | 30.6kB |
| Number of I/O | 193 |
| RAM Size | 27.6kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 12000 |
| Total RAM Bits | 226304 |
| Number of LABs/CLBs | 1500 |
| Combinatorial Delay of a CLB-Max | 0.331 ns |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
LFE2-12E-6FN256I Overview
Fpga chips is supplied in the 256-BGA package. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 193 I/Os in order to transfer data in a more efficient manner. In order to construct a fundamental building block, 12000 logic elements/cells are required. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. As part of the ECP2 series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~100°C TJ at all times. A device such as this one has 193 outputs built into it. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. In total, it has a total of 256 terminations. This device has 226304 RAM bits, which is the number of RAM bits that this device offers. Related parts can be found by using its base part number LFE2-12. This FPGA module has a RAM si27.6kBe of 27.6kB that is sufficient to make sure that the program is able to run normally. In this case, 256 pins are used in the design. An array of 1500 LABs/CLBs is built into the FPGA. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. The 1.2V supply voltage provides designers with full flexibility in their designs. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. Typically, fpga semiconductor uses a crystal oscillating at 357MHz . In this FPGA module, there is a memory of 30.6kB that can be used to store programs and data.
LFE2-12E-6FN256I Features
193 I/Os
Up to 226304 RAM bits
256 LABs/CLBs
LFE2-12E-6FN256I Applications
There are a lot of Lattice Semiconductor Corporation LFE2-12E-6FN256I FPGAs applications.
- Enterprise networking
- Industrial Ethernet
- Automotive driver's assistance
- Ecosystem
- Automotive
- Cryptography
- ASIC prototyping
- Computer hardware emulation
- Software-defined radios
- Automotive Applications
