Parameters |
Combinatorial Delay of a CLB-Max |
0.331 ns |
Number of Logic Cells |
20000 |
Height Seated (Max) |
2.1mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2008 |
Series |
ECP2 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE2-20 |
Pin Count |
256 |
Number of Outputs |
193 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Memory Size |
39.8kB |
Number of I/O |
193 |
RAM Size |
34.5kB |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
21000 |
Total RAM Bits |
282624 |
Max Frequency |
357MHz |
Number of LABs/CLBs |
2625 |
LFE2-20SE-6FN256C Overview
In the 256-BGA package, you will find fpga chips. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. This device features 193 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 21000 logic elements/cells. The supply voltage is 1.2V volts. This FPGA part belongs to the family of Field Programmable Gate Arrays. FPGA modules can be attached to development boards using a Surface Mount-connector. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the ECP2 seies. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In order to make this device as versatile as possible, there are 193 different outputs included. There is an FPGA model contained in Tray in order to conserve space. The total number of terminations is 256. Fpga electronics is worth mentioning that this device provides 282624 bfpga electronics s of RAM. If you are looking for related parts, you can use the base part number LFE2-20 as a starting point. There is a maximum RAM si34.5kBe of 34.5kB on this FPGA module, which is necessary to ensure the normal operation of the program. In this case, there are 256 pins on the board. 2625 LABs/CLBs are integrated into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. Fpga semiconductor is equipped wfpga semiconductorh 256 pin count. This FPGA module embeds a memory of 39.8kB available for storing programs and data. This FPGA can get as fast as 357MHz. In order for the building block to work, fpga semiconductor consists of 20000 logic cells.
LFE2-20SE-6FN256C Features
193 I/Os
Up to 282624 RAM bits
256 LABs/CLBs
LFE2-20SE-6FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFE2-20SE-6FN256C FPGAs applications.
- Data center search engines
- Military DSP
- Defense Applications
- Device controllers
- Data center hardware accelerators
- Medical ultrasounds
- Filtering and communication encoding
- DO-254
- Aircraft navigation
- Broadcast