LFE2-70E-6FN900I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | ECP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2-70 |
| Pin Count | 900 |
| Number of Outputs | 583 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Memory Size | 146kB |
| Number of I/O | 583 |
| RAM Size | 129kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 68000 |
| Total RAM Bits | 1056768 |
| Number of LABs/CLBs | 8500 |
| Combinatorial Delay of a CLB-Max | 0.331 ns |
| Number of Logic Cells | 70000 |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2-70E-6FN900I Overview
A 900-BBGA package is provided with this component. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 68000 logic elements/cells. Power is provided by a 1.2V-volt supply. Field Programmable Gate Arrays family FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. The supply voltage of the device is 1.14V~1.26V , at which it runs. This is a type of FPGA that is part of the ECP2 series of FPGAs. While operating, the operating temperature should be kept within a range of -40°C~100°C TJ. In this device, there are 583 outputs that can be used. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. 900 terminations are present in total. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1056768 bFpga chipss. In order to find related parts, you can use its base part number LFE2-70. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device is designed with 900 pins in total. The FPGA consists of 8500 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. Its flexibility can be fully utilized when operating with a 1.2V supply voltage. There are a total of 900 pins on this device. Fpga semiconductor typically uses a crystal oscillating at 357MHz. Data and programs can be stored in this FPGA module's 146kB memory. For the building block, it incorporates 70000 logic cells that are used to make it work.
LFE2-70E-6FN900I Features
583 I/Os
Up to 1056768 RAM bits
900 LABs/CLBs
LFE2-70E-6FN900I Applications
There are a lot of Lattice Semiconductor Corporation LFE2-70E-6FN900I FPGAs applications.
- Integrating multiple SPLDs
- Secure Communication
- Random logic
- Space Applications
- Solar Energy
- Cryptography
- Automotive Applications
- Industrial,Medical and Scientific Instruments
- Video & Image Processing
- Development Boards and Shields for Microcontrollers
