Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
900-BBGA |
Number of Pins |
900 |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2008 |
Series |
ECP2 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
900 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE2-70 |
Pin Count |
900 |
Number of Outputs |
583 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Memory Size |
146kB |
Number of I/O |
583 |
RAM Size |
129kB |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
68000 |
Total RAM Bits |
1056768 |
Max Frequency |
311MHz |
Number of LABs/CLBs |
8500 |
Combinatorial Delay of a CLB-Max |
0.358 ns |
Number of Logic Cells |
70000 |
Height Seated (Max) |
2.6mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LFE2-70SE-5FN900I Overview
As part of the 900-BBGA package, it is included. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. A total of 583 I/Os are programmed to ensure a more coherent data transfer. There are 68000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.2V. Part of the Field Programmable Gate Arrays family, this FPGA part is a programmable gate array. Surface Mount-connectors can be used to attach this FPGA module to the development board. This device is powered by a 1.14V~1.26V battery. The FPGA belongs to the ECP2 series of FPGAs, and it is one type of FPGA. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. In this device, 583 outputs are incorporated in order to provide you with maximum flexibility. It is for space saving reasons that this FPGA model is contained in Tray. Total terminations are 900. A device like this one offers 1056768 RAM bits, which is a considerable amount of memory. Its base part number LFE2-70 can be used to find related parts. The RAM si129kBe of this FPGA module reaches 129kB so as to guarantee the normal operation of the program during operation. This cable has 900 pins and is designed to connect to a computer. An array of 8500 LABs/CLBs is built into the FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Designers can fully utilize its flexibility with 1.2V supply voltage. This device has a pin count of 900 in fpga semiconductor. This FPGA module embeds a memory of 146kB available for storing programs and data. It is possible to achieve a speed of up to 311MHz with this FPGA. In order for the building block to work, fpga semiconductor consists of 70000 logic cells.
LFE2-70SE-5FN900I Features
583 I/Os
Up to 1056768 RAM bits
900 LABs/CLBs
LFE2-70SE-5FN900I Applications
There are a lot of Lattice Semiconductor Corporation LFE2-70SE-5FN900I FPGAs applications.
- Automotive
- Artificial intelligence (AI)
- OpenCL
- Digital signal processing
- DO-254
- Industrial,Medical and Scientific Instruments
- Radar and Sensors
- Industrial IoT
- Filtering and communication encoding
- Data Mining