LFE2-70SE-7FN900C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | ECP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2-70 |
| Pin Count | 900 |
| Number of Outputs | 583 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Memory Size | 146kB |
| Number of I/O | 583 |
| RAM Size | 129kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 68000 |
| Total RAM Bits | 1056768 |
| Max Frequency | 420MHz |
| Number of LABs/CLBs | 8500 |
| Combinatorial Delay of a CLB-Max | 0.304 ns |
| Number of Logic Cells | 70000 |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2-70SE-7FN900C Overview
In the package 900-BBGA, this product is provided. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. There are 583 I/Os for better data transfer. A fundamental building block is made up of 68000 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. Field Programmable Gate Arrays family FPGA part. Using a Surface Mount connector, you can mount this FPGA module on the development board. The supply voltage of the device is 1.14V~1.26V , at which it runs. This is a type of FPGA that is part of the ECP2 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. The device has 583 outputs that are integrated into it. There is an FPGA model contained in Tray in order to conserve space. 900 terminations are present in total. As far as the RAM bits are concerned, this device offers you a total of 1056768. Parts related to this part can be found using its base part number LFE2-70. It is crucial that the RAM si129kBe of this FPGA module reaches 129kB so that the program can run normally. 900 pins are designed into the device. Fpga electronics contains 8500 LABs/CLBs in an array. Providing that this FPGA is mounted in Surface Mount, it will be able to perform according to its specifications in a flawless manner. Designers can fully utilize its flexibility with 1.2V supply voltage. With a total of 900 pins, it is equipped with a high level of security. For storing programs and data, this FPGA module embeds memory 146kB. It is possible to achieve a speed of up to 420MHz with this FPGA. It incorporates 70000 logic cells used for the building block.
LFE2-70SE-7FN900C Features
583 I/Os
Up to 1056768 RAM bits
900 LABs/CLBs
LFE2-70SE-7FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2-70SE-7FN900C FPGAs applications.
- Automotive advanced driver assistance systems (ADAS)
- Filtering and communication encoding
- Automotive driver's assistance
- Distributed Monetary Systems
- Medical Electronics
- Data Center
- Scientific Instruments
- Military DSP
- Industrial Ethernet
- Military Temperature
