Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
900-BBGA |
Number of Pins |
900 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
ECP2M |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
900 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE2M50 |
Pin Count |
900 |
Number of Outputs |
410 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Memory Size |
531kB |
Number of I/O |
410 |
RAM Size |
518.4kB |
Clock Frequency |
311MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
48000 |
Total RAM Bits |
4246528 |
Number of LABs/CLBs |
6000 |
Combinatorial Delay of a CLB-Max |
0.358 ns |
Number of Logic Cells |
50000 |
Height Seated (Max) |
2.6mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LFE2M50SE-5FN900C Overview
As part of the 900-BBGA package, it is included. A FIELD PROGRAMMABLE GATE ARRAY-based FPGA is one of these types. The device has 410 I/O ports for more coherent data transfer. There are 48000 logic elements/cells to form a fundamental building block. It is powered from a supply voltage of 1.2V. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. The supply voltage of the device is 1.14V~1.26V , at which it runs. The FPGA belongs to the ECP2M series of FPGAs, and it is one type of FPGA. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. In this device, 410 outputs are incorporated in order to provide you with maximum flexibility. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As a whole, it has 900 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4246528 bFpga chipss. For related parts, use its base part number LFE2M50. For the program to work properly, the RAM si518.4kBe of this FPGA module must reach 518.4kB GB in order to ensure normal operation. The device has 900 pins which are included in the design. 6000 LABs/CLBs are configured on this FPGA. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. Designers can fully utilize its flexibility with 1.2V supply voltage. I am going to present you with a device that is equipped with 900 pins. Most commonly, this device makes use of an oscillating crystal frequency of 311MHz to operate. There is a memory of 531kB embedded in this FPGA module, which can be used for storing programs and data. During the construction of the building block, there are 50000 logic cells used.
LFE2M50SE-5FN900C Features
410 I/Os
Up to 4246528 RAM bits
900 LABs/CLBs
LFE2M50SE-5FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M50SE-5FN900C FPGAs applications.
- Audio
- Server Applications
- Solar Energy
- Development Boards and Shields for Microcontrollers
- Aerospace and Defense
- Artificial intelligence (AI)
- DO-254
- Enterprise networking
- High Performance Computing
- Data Center