Parameters |
Number of LABs/CLBs |
6000 |
Combinatorial Delay of a CLB-Max |
0.304 ns |
Number of Logic Cells |
50000 |
Height Seated (Max) |
2.6mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
900-BBGA |
Number of Pins |
900 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
ECP2M |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
900 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE2M50 |
Pin Count |
900 |
Number of Outputs |
410 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Memory Size |
531kB |
Number of I/O |
410 |
RAM Size |
518.4kB |
Clock Frequency |
420MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
48000 |
Total RAM Bits |
4246528 |
LFE2M50SE-7FN900C Overview
Fpga chips is supplied in the 900-BBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. The device has 410 I/O ports for more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. In order to operate fpga chips, a voltage supply of 1.2V volts is required. There is a Field Programmable Gate Arrays family component in this FPGA part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. An FPGA belonging to the ECP2M series is referred to as an FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. This device is equipped with 410 separate outputs, which makes it a very versatile device. In order to save space, this FPGA model has been contained in Tray. There are a total of 900 terminations. Having a RAM bit size of 4246528 means that this device will offer you a lot of memory. Its base part number LFE2M50 can be used to find parts that are related to it. The RAM si518.4kBe of this FPGA module reaches 518.4kB so as to guarantee the normal operation of the program during operation. In this case, there are 900 pins on the board. A total of 6000 LABs/CLBs make up this FPGA array. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. With a 1.2V supply voltage, designers can fully utilize the flexibility of the device. In addition to this, it has 900 pins. It usually uses a 420MHz crystal. Programs and data can be stored in the 531kB memory embedded in this FPGA module. For the building block, it incorporates 50000 logic cells that are used to make it work.
LFE2M50SE-7FN900C Features
410 I/Os
Up to 4246528 RAM bits
900 LABs/CLBs
LFE2M50SE-7FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M50SE-7FN900C FPGAs applications.
- Software-defined radios
- Development Boards and Shields for Microcontrollers
- Medical imaging
- Aerospace and Defense
- Consumer Electronics
- Military Temperature
- Secure Communication
- Scientific Instruments
- Data center search engines
- Data Mining