LFE2M70E-5FN900C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | ECP2M |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 311MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2M70 |
| Pin Count | 900 |
| Number of Outputs | 416 |
| Operating Supply Voltage | 1.2V |
| Memory Size | 584.9kB |
| Number of I/O | 416 |
| RAM Size | 566.8kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 67000 |
| Total RAM Bits | 4642816 |
| Number of LABs/CLBs | 8375 |
| Number of Macro Cells | 34000 |
| Combinatorial Delay of a CLB-Max | 0.358 ns |
| Number of Logic Cells | 70000 |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| Radiation Hardening | No |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2M70E-5FN900C Overview
There is a 900-BBGA package that includes this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 416 I/Os help it transfer data more efficiently. In order to construct a fundamental building block, 67000 logic elements/cells are required. Fpga chips is powered from a supply voltage of 1.2V. A Field Programmable Gate Arrays-series FPGA part. The Surface Mount-slot on the development board allows you to attach the FPGA module. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. The ECP2M Series is one of the types of FPGAs that belong to this type. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. This device is equipped with 416 separate outputs, which makes it a very versatile device. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. As a whole, it has 900 terminations. A device like this one offers 4642816 RAM bits, which is a considerable amount of memory. Related parts can be found by using its base part number LFE2M70. For the program to work properly, the RAM si566.8kBe of this FPGA module must reach 566.8kB GB in order to ensure normal operation. The device has 900 pins which are included in the design. The FPGA is built as an array of 8375 latches or CLBs. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. The 1.2V supply voltage provides designers with full flexibility in their designs. A total of 900 pins are included in this device. Data and programs can be stored in this FPGA module's 584.9kB memory. This device operates at a frequency of 311MHz in order to provide high efficiency. It incorporates 70000 logic cells used for the building block. CPLDs are built and controlled by a number of macrocells, which is the main part of the device.
LFE2M70E-5FN900C Features
416 I/Os
Up to 4642816 RAM bits
900 LABs/CLBs
Operating from a frequency of 311MHz
LFE2M70E-5FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M70E-5FN900C FPGAs applications.
- Solar Energy
- Automotive advanced driver assistance systems (ADAS)
- Development Boards and Shields for Microcontrollers
- Random logic
- Security systems
- Aerospace and Defense
- Secure Communication
- Automation
- Industrial,Medical and Scientific Instruments
- DO-254
