Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
900-BBGA |
Number of Pins |
900 |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
ECP2M |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
900 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE2M70 |
Pin Count |
900 |
Number of Outputs |
416 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Memory Size |
584.9kB |
Number of I/O |
416 |
RAM Size |
566.8kB |
Clock Frequency |
357MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
67000 |
Total RAM Bits |
4642816 |
Number of LABs/CLBs |
8375 |
Combinatorial Delay of a CLB-Max |
0.331 ns |
Number of Logic Cells |
70000 |
Height Seated (Max) |
2.6mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LFE2M70E-6FN900I Overview
This package is included in the 900-BBGA package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. A total of 416 I/Os allow data to be transferred in a more coherent manner. A fundamental building block consists of 67000 logic elements/cells. In order for the device to operate, a supply voltage of 1.2V volts needs to be provided. This FPGA part belongs to the family of Field Programmable Gate Arrays. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The ECP2M series FPGA is a type of FPGA that belongs to the ECP2M family of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of -40°C~100°C TJ when operating the machine. During the installation of this device, 416 outputs were incorporated. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Fpga chips is designed wFpga chipsh 900 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4642816 bFpga chipss. In order to find related parts, you can use its base part number LFE2M70. Fpga electronics is important that this FPGA module has a RAM si566.8kBe of 566.8kB in order to ensure that the program will run normally. There are 900 pins on this device. 8375 LABs and CLBs are built into this FPGA. Providing the FPGA is mounted in Surface Mount as per the specifications of the IC, then it should work perfectly according to its specifications. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. In addition to this, it has 900 pins. It usually uses a crystal oscillating at a frequency of 357MHz in order to do its work. A memory of 584.9kB is embedded in this FPGA module for storing data and programs. It is composed of 70000 logic cells which serve as the building blocks of the application.
LFE2M70E-6FN900I Features
416 I/Os
Up to 4642816 RAM bits
900 LABs/CLBs
LFE2M70E-6FN900I Applications
There are a lot of Lattice Semiconductor Corporation LFE2M70E-6FN900I FPGAs applications.
- Scientific Instruments
- High Performance Computing
- Camera time adjustments
- Data center hardware accelerators
- Automotive driver's assistance
- ADAS
- Bioinformatics
- Defense Applications
- ASIC prototyping
- Data center search engines