LFE2M70E-7FN900C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 900-BBGA |
| Number of Pins | 900 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | ECP2M |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 900 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2M70 |
| Pin Count | 900 |
| Number of Outputs | 416 |
| Operating Supply Voltage | 1.2V |
| Memory Size | 584.9kB |
| Number of I/O | 416 |
| RAM Size | 566.8kB |
| Clock Frequency | 420MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 67000 |
| Total RAM Bits | 4642816 |
| Number of LABs/CLBs | 8375 |
| Combinatorial Delay of a CLB-Max | 0.304 ns |
| Number of Logic Cells | 70000 |
| Height Seated (Max) | 2.6mm |
| Length | 31mm |
| Width | 31mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2M70E-7FN900C Overview
There are two packages that contain fpga chips: 900-BBGA package and X package. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 416 I/Os for transferring data in a more coherent manner. A fundamental building block is made up of 67000 logic elements/cells. It is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. An FPGA belonging to the ECP2M series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 416 outputs were incorporated. A model of this FPGA is contained in Tray for the purpose of saving space. In total, it has a total of 900 terminations. This device has 4642816 RAM bits, which is the number of RAM bits that this device offers. You can find related parts by using the part number LFE2M70, which is its base part number. The FPGA module's RAM si566.8kBe reaches 566.8kB in order to ensure that the program operates in a normal manner. The device has 900 pins which are included in the design. 8375 LABs and CLBs are built into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A 1.2V-volt supply allows designers to fully utilize its flexibility. As far as the pin count is concerned, it has 900 pins. A crystal oscillating at 420MHz is one of the most common components of this device. In this FPGA module, there is a memory of 584.9kB available for storing applications and data. During the construction of the building block, there are 70000 logic cells used.
LFE2M70E-7FN900C Features
416 I/Os
Up to 4642816 RAM bits
900 LABs/CLBs
LFE2M70E-7FN900C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M70E-7FN900C FPGAs applications.
- DO-254
- High Performance Computing
- Industrial,Medical and Scientific Instruments
- Development Boards and Shields for Microcontrollers
- Industrial Ethernet
- Video & Image Processing
- Data Mining
- ADAS
- Automotive driver's assistance
- Electronic Warfare
