LFE2M70SE-6FN1152C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 1152-BBGA |
| Number of Pins | 1152 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | ECP2M |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE2M70 |
| Number of Outputs | 436 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Memory Size | 584.9kB |
| Number of I/O | 436 |
| RAM Size | 566.8kB |
| Clock Frequency | 357MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 67000 |
| Total RAM Bits | 4642816 |
| Number of LABs/CLBs | 8375 |
| Combinatorial Delay of a CLB-Max | 0.331 ns |
| Number of Logic Cells | 70000 |
| Height Seated (Max) | 2.6mm |
| Length | 35mm |
| Width | 35mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE2M70SE-6FN1152C Overview
In the package 1152-BBGA, this product is provided. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Fpga chips is programmed wFpga chipsh 436 I/Os for transferring data in a more coherent manner. A fundamental building block is made up of 67000 logic elements/cells. The supply voltage is 1.2V volts. An FPGA part from the Field Programmable Gate Arrays family. An attachment Surface Mount allows the FPGA module to be attached to the development board. There is a 1.14V~1.26V-volt supply voltage required for the device to operate. This is a type of FPGA that is part of the ECP2M series of FPGAs. Fpga chips is important to maintain the operating temperature wFpga chipshin the range of 0°C~85°C TJ when operating the machine. There are 436 outputs incorporated in this device. This FPGA model is contained in Tray for space saving. As far as the RAM bits are concerned, this device offers you a total of 4642816. Its base part number LFE2M70 can be used to find related parts. There is a maximum RAM si566.8kBe of 566.8kB on this FPGA module, which is necessary to ensure the normal operation of the program. 1152 pins are designed into the device. 8375 LABs/CLBs are integrated into this FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Fpga semiconductor typically uses a crystal oscillating at 357MHz. For storing programs and data, this FPGA module embeds memory 584.9kB. As part of the building blocks, it consists of 70000 logic cells.
LFE2M70SE-6FN1152C Features
436 I/Os
Up to 4642816 RAM bits
1152 LABs/CLBs
LFE2M70SE-6FN1152C Applications
There are a lot of Lattice Semiconductor Corporation LFE2M70SE-6FN1152C FPGAs applications.
- Embedded Vision
- Military Temperature
- Device controllers
- Camera time adjustments
- Server Applications
- Solar Energy
- DO-254
- Data Center
- Broadcast
- Security systems
