Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2012 |
Series |
ECP3 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
LFE3-35 |
Pin Count |
256 |
Number of Outputs |
133 |
Operating Supply Voltage |
1.2V |
Memory Size |
174.4kB |
Operating Supply Current |
53.7mA |
Number of I/O |
133 |
RAM Size |
165.9kB |
Clock Frequency |
375MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
33000 |
Density |
1.3 Mb |
Total RAM Bits |
1358848 |
Number of LABs/CLBs |
4125 |
Number of Logic Blocks (LABs) |
72 |
Combinatorial Delay of a CLB-Max |
0.379 ns |
Height |
1.25mm |
Length |
17mm |
Width |
17mm |
Radiation Hardening |
No |
REACH SVHC |
No SVHC |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LFE3-35EA-6FTN256C Overview
There are two packages that contain fpga chips: 256-BGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Having 133 I/Os makes data transfers more coherent. To form a fundamental building block, there are 33000 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. FPGA parts like this belong to the Field Programmable Gate Arrays family. The Surface Mount-slot on the development board allows you to attach the FPGA module. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. The FPGA belongs to the ECP3 series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In this device, 133 outputs are incorporated in order to provide you with maximum flexibility. In order to save space, this FPGA model has been contained in Tray. In total, the terminations of this piece are 256. There are 1358848 RAM bits that are available with this device. In order to find related parts, you can use its base part number LFE3-35. There is a maximum RAM si165.9kBe of 165.9kB on this FPGA module, which is necessary to ensure the normal operation of the program. The device is designed with 256 pins in total. 4125 LABs/CLBs are integrated into this FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. A total of 256 pins are included in this device. 72 logic blocks (LABs) constitute its basic building block. Most of the time, it uses a crystal oscillating at 375MHz to generate the signal. For storing programs and data, this FPGA module embeds memory 174.4kB. Fpga semiconductor operates on a 53.7mA power supply.
LFE3-35EA-6FTN256C Features
133 I/Os
Up to 1358848 RAM bits
256 LABs/CLBs
72 logic blocks (LABs)
LFE3-35EA-6FTN256C Applications
There are a lot of Lattice Semiconductor Corporation LFE3-35EA-6FTN256C FPGAs applications.
- Military DSP
- Audio
- Software-defined radios
- Security systems
- Wired Communications
- High Performance Computing
- ADAS
- Development Boards and Shields for Microcontrollers
- Radar and Sensors
- Data Mining