LFE3-35EA-6FTN256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | ECP3 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE3-35 |
| Pin Count | 256 |
| Number of Outputs | 133 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Number of I/O | 133 |
| RAM Size | 165.9kB |
| Clock Frequency | 375MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 33000 |
| Total RAM Bits | 1358848 |
| Number of LABs/CLBs | 4125 |
| Number of Logic Blocks (LABs) | 72 |
| Combinatorial Delay of a CLB-Max | 0.379 ns |
| Height Seated (Max) | 1.55mm |
| Length | 17mm |
| Width | 17mm |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE3-35EA-6FTN256I Overview
A 256-BGA package is provided with this component. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. Fpga chips is programmed wFpga chipsh 133 I/Os for transferring data in a more coherent manner. A fundamental building block consists of 33000 logic elements/cells. 1.2V volts power it. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. An FPGA module can be attached to a development board with a Surface Mount-pin. Powered by a 1.14V~1.26V supply voltage, fpga chips is able to operate at high speeds. The ECP3 Series is one of the types of FPGAs that belong to this type. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, there are 133 outputs that can be used. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 256. This device has 1358848 RAM bits, which is the number of RAM bits that this device offers. In order to find related parts, use the part number LFE3-35 as a base. During the configuration of this FPGA module, the RAM si165.9kBe reaches 165.9kB to ensure that the program runs normally. In this case, 256 pins are used in the design. A total of 4125 LABs/CLBs make up this FPGA array. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. With a total of 256 pins, it is equipped with a high level of security. 72 logic blocks (LABs) constitute its basic building block. Usually, fpga semiconductor uses a 375MHz crystal.
LFE3-35EA-6FTN256I Features
133 I/Os
Up to 1358848 RAM bits
256 LABs/CLBs
72 logic blocks (LABs)
LFE3-35EA-6FTN256I Applications
There are a lot of Lattice Semiconductor Corporation LFE3-35EA-6FTN256I FPGAs applications.
- ADAS
- Telecommunication
- Automotive driver's assistance
- Data center hardware accelerators
- Camera time adjustments
- Bioinformatics
- Aerospace and Defense
- Audio
- Development Boards and Shields for Microcontrollers
- Automotive advanced driver assistance systems (ADAS)
