LFE3-70EA-7FN672I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 672-BBGA |
| Number of Pins | 672 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | ECP3 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 672 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFE3-70 |
| Pin Count | 672 |
| Number of Outputs | 380 |
| Operating Supply Voltage | 1.2V |
| Memory Size | 570.6kB |
| Operating Supply Current | 18mA |
| Number of I/O | 380 |
| RAM Size | 552.5kB |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 67000 |
| Total RAM Bits | 4526080 |
| Max Frequency | 420MHz |
| Number of LABs/CLBs | 8375 |
| Combinatorial Delay of a CLB-Max | 0.335 ns |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFE3-70EA-7FN672I Overview
Fpga chips is supplied in the 672-BBGA package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Fpga chips is programmed wFpga chipsh 380 I/Os for transferring data in a more coherent manner. Logic blocks consist of 67000 logic elements/cells. The supply voltage is 1.2V volts. A Field Programmable Gate Arrays-series FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the ECP3 seies. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range -40°C~100°C TJ while the machine is operating. In order to make this device as versatile as possible, there are 380 different outputs included. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 672. The RAM bits that this device offer is 4526080. In order to find related parts, use the part number LFE3-70 as a base. A significant amount of RAM is allocated to this FPGA module to ensure that the program can operate normally. The device is designed with 672 pins in total. An array of 8375 LABs/CLBs is built into the FPGA. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. In addition to this, it has 672 pins. In this FPGA module, there is a memory of 570.6kB available for storing applications and data. As fast as 420MHz can be reached with this FPGA. Fpga semiconductor operates on 18mA of supply current.
LFE3-70EA-7FN672I Features
380 I/Os
Up to 4526080 RAM bits
672 LABs/CLBs
LFE3-70EA-7FN672I Applications
There are a lot of Lattice Semiconductor Corporation LFE3-70EA-7FN672I FPGAs applications.
- Development Boards and Shields for Microcontrollers
- ADAS
- Solar Energy
- Digital signal processing
- Medical Applications
- Audio
- Integrating multiple SPLDs
- Industrial Ethernet
- Voice recognition
- Automotive advanced driver assistance systems (ADAS)
