Parameters |
Number of Logic Cells |
1216 |
Height Seated (Max) |
2.1mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2007 |
Series |
XP |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
1.71V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.8V |
Terminal Pitch |
1mm |
Frequency |
320MHz |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
LFXP10 |
Pin Count |
256 |
Number of Outputs |
188 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.8V |
Power Supplies |
1.8/2.5/3.3V |
Memory Size |
31.9kB |
Number of I/O |
188 |
RAM Size |
27kB |
Organization |
1216 CLBS |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
10000 |
Total RAM Bits |
221184 |
Number of Logic Blocks (LABs) |
1250 |
Combinatorial Delay of a CLB-Max |
0.63 ns |
Number of CLBs |
1216 |
LFXP10C-3FN256C Overview
In the package 256-BGA, this product is provided. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. Fpga chips is programmed wFpga chipsh 188 I/Os for transferring data in a more coherent manner. In order to construct a fundamental building block, 10000 logic elements/cells are required. It is powered from a supply voltage of 1.8V. There is a Field Programmable Gate Arrays family component in this FPGA part. With a Surface Mount connector, this FPGA module can be attached to the development board. A supply voltage of 1.71V~3.465V is needed in order for fpga chips to operate. The FPGA belongs to the XP series of FPGAs, and it is one type of FPGA. During the operation of the system, the operating temperature should remain within the range of 0°C~85°C TJ. In this device, 188 outputs are incorporated in order to provide you with maximum flexibility. As a space-saving measure, this FPGA model is contained within Tray. In total, the terminations of this piece are 256. This device is equipped with 221184 RAM bits in terms of its RAM si221184e. For related parts, use its base part number LFXP10. The RAM si27kBe of this FPGA module reaches 27kB so as to guarantee the normal operation of the program during operation. The device has 256 pins which are included in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In operation with 1.8V, designers can take advantage of its flexibility to the fullest extent. There is a 1.8/2.5/3.3V power supply that is required to operate it. In addition to this, it has 256 pins. There are 1250 logic blocks (LABs) in the system, which form its basic building blocks. Programs and data can be stored in the 31.9kB memory embedded in this FPGA module. A CLB is a basic module that determines the architecture of a system. With a frequency of 320MHz, it delivers high efficiency. As most of the logic cells for the building blocks are 1216 logic cells, it incorporates a lot of logic.
LFXP10C-3FN256C Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
1250 logic blocks (LABs)
Operating from a frequency of 320MHz
LFXP10C-3FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP10C-3FN256C FPGAs applications.
- ASIC prototyping
- Military DSP
- Software-defined radios
- Distributed Monetary Systems
- Computer hardware emulation
- Telecommunication
- Wireless Communications
- Consumer Electronics
- Military Temperature
- Data center hardware accelerators