LFXP10C-5FN256C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | XP |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Frequency | 400MHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP10 |
| Pin Count | 256 |
| Number of Outputs | 188 |
| Operating Supply Voltage | 1.8V |
| Power Supplies | 1.8/2.5/3.3V |
| Memory Size | 31.9kB |
| Number of I/O | 188 |
| RAM Size | 27kB |
| Organization | 1216 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 10000 |
| Total RAM Bits | 221184 |
| Combinatorial Delay of a CLB-Max | 0.44 ns |
| Number of CLBs | 1216 |
| Number of Logic Cells | 1216 |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
LFXP10C-5FN256C Overview
A 256-BGA package contains it, and it is available for download. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. 188 I/Os are available for transferring data more efficiently. A fundamental building block contains 10000 logic elements or cells. It is powered from a supply voltage of 1.8V. The Field Programmable Gate Arrays family of FPGA parts includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order for it to operate, the supply voltage must be 1.71V~3.465V . There are many types of FPGAs in the XP series, this is one of them. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. In this device, there are 188 outputs that can be used. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Total terminations are 256. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 221184 bFpga chipss. Parts related to this part can be found using its base part number LFXP10. For the program to work properly, the RAM si27kBe of this FPGA module must reach 27kB GB in order to ensure normal operation. The device is designed with 256 pins in total. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Designers can fully utilize its flexibility with 1.8V supply voltage. Powered by a 1.8/2.5/3.3V power supply, it can be operated by almost anyone. The device has a total of 256 pins on fpga semiconductor. There is a memory of 31.9kB embedded inside this FPGA module that can be used to store programs and data. A CLB is a basic module that determines the architecture of a system. This device operates at a frequency of 400MHz in order to provide high efficiency. Fpga semiconductor incorporates 1216 logic cells used for the building block.
LFXP10C-5FN256C Features
188 I/Os
Up to 221184 RAM bits
256 LABs/CLBs
Operating from a frequency of 400MHz
LFXP10C-5FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP10C-5FN256C FPGAs applications.
- Artificial intelligence (AI)
- Video & Image Processing
- Software-defined radios
- Integrating multiple SPLDs
- Data Center
- Solar Energy
- Medical imaging
- Server Applications
- Audio
- Distributed Monetary Systems
