Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2007 |
Series |
XP |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
1.71V~3.465V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Supply Voltage |
1.8V |
Terminal Pitch |
1mm |
Frequency |
400MHz |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
LFXP15 |
Pin Count |
256 |
Number of Outputs |
188 |
Operating Supply Voltage |
1.8V |
Power Supplies |
1.8/2.5/3.3V |
Memory Size |
48.1kB |
Number of I/O |
188 |
RAM Size |
40.5kB |
Organization |
1932 CLBS |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
15000 |
Total RAM Bits |
331776 |
Number of Logic Blocks (LABs) |
1875 |
Combinatorial Delay of a CLB-Max |
0.44 ns |
Number of CLBs |
1932 |
Number of Logic Cells |
1932 |
Height Seated (Max) |
2.1mm |
Length |
17mm |
Width |
17mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
LFXP15C-5FN256C Overview
Fpga chips is supplied in the 256-BGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. This device features 188 I/Os in order to transfer data in a more efficient manner. A fundamental building block is made up of 15000 logic elements/cells. Supply voltage is 1.8V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.71V~3.465V . The FPGA belongs to the XP series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. A total of 188 outputs are incorporated into this device. This FPGA model is contained in Tray for space saving. Total terminations are 256. As far as the RAM bits are concerned, this device offers you a total of 331776. You can find related parts by using the part number LFXP15, which is its base part number. There is a maximum RAM si40.5kBe of 40.5kB on this FPGA module, which is necessary to ensure the normal operation of the program. The device has 256 pins which are included in the design. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. A 1.8V-volt supply allows designers to fully utilize its flexibility. It is powered by a 1.8/2.5/3.3V battery, which can be purchased separately. This device has a pin count of 256 in fpga semiconductor. 1875 logic blocks (LABs) make up its basic building blocks. In this FPGA module, there is a memory of 48.1kB available for storing applications and data. In its architecture, there are 1932 CLB modules. To achieve high efficiency, it runs at a frequency of 400MHz. During the construction of the building block, there are 1932 logic cells used.
LFXP15C-5FN256C Features
188 I/Os
Up to 331776 RAM bits
256 LABs/CLBs
1875 logic blocks (LABs)
Operating from a frequency of 400MHz
LFXP15C-5FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP15C-5FN256C FPGAs applications.
- Automotive driver's assistance
- ADAS
- DO-254
- Enterprise networking
- ASIC prototyping
- Audio
- Software-defined radios
- Aircraft navigation
- Wired Communications
- Automotive Applications