LFXP2-30E-7FN672C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 672-BBGA |
| Number of Pins | 672 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | XP2 |
| JESD-609 Code | e1 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 672 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFXP2-30 |
| Pin Count | 672 |
| Number of Outputs | 472 |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Memory Size | 55.4kB |
| Number of I/O | 472 |
| RAM Size | 48.4kB |
| Clock Frequency | 435MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 29000 |
| Total RAM Bits | 396288 |
| Number of LABs/CLBs | 3625 |
| Combinatorial Delay of a CLB-Max | 0.304 ns |
| Height Seated (Max) | 2.6mm |
| Length | 27mm |
| Width | 27mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFXP2-30E-7FN672C Overview
A 672-BBGA package is provided with this component. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. 472 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 29000 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. There is a Field Programmable Gate Arrays family component in this FPGA part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. This is a type of FPGA that is part of the XP2 series of FPGAs. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A device such as this one has 472 outputs built into it. As a space-saving measure, this FPGA model is contained within Tray. Fpga chips is designed wFpga chipsh 672 terminations. The RAM bits that this device offer is 396288. In order to find related parts, you can use its base part number LFXP2-30. For the program to work properly, the RAM si48.4kBe of this FPGA module must reach 48.4kB GB in order to ensure normal operation. The device is designed with 672 pins in total. The FPGA consists of 3625 LABs/CLBs. As long as this FPGA is mounted in Surface Mount, it could work fantastically according to its specifications. When operating with the supply voltage of 1.2V, designers can fully make use of its flexibility. An external power supply of 1.21.2/3.33.3V is required to power the device. With a total of 672 pins, it is equipped with a high level of security. It usually uses a 435MHz crystal. Data and programs can be stored in this FPGA module's 55.4kB memory.
LFXP2-30E-7FN672C Features
472 I/Os
Up to 396288 RAM bits
672 LABs/CLBs
LFXP2-30E-7FN672C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-30E-7FN672C FPGAs applications.
- ASIC prototyping
- Filtering and communication encoding
- Voice recognition
- Distributed Monetary Systems
- Server Applications
- Cryptography
- Medical imaging
- Automation
- Medical ultrasounds
- Industrial IoT
