LFXP2-30E-7FTN256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2012 |
| Series | XP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP2-30 |
| Pin Count | 256 |
| Number of Outputs | 201 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Memory Size | 55.4kB |
| Number of I/O | 201 |
| RAM Size | 48.4kB |
| Clock Frequency | 435MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 29000 |
| Total RAM Bits | 396288 |
| Number of LABs/CLBs | 3625 |
| Combinatorial Delay of a CLB-Max | 0.304 ns |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFXP2-30E-7FTN256C Overview
Fpga chips is supplied in the 256-LBGA package. The FIELD PROGRAMMABLE GATE ARRAY-series of FPGAs are composed of this type. The device has 201 I/O ports for more coherent data transfer. A fundamental building block contains 29000 logic elements or cells. Power is provided by a 1.2V-volt supply. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. A supply voltage of 1.14V~1.26V is needed in order for fpga chips to operate. The XP2 Series is one of the types of FPGAs that belong to this type. While operating, the operating temperature should be kept within a range of 0°C~85°C TJ. In this device, there are 201 outputs that can be used. It is for space saving reasons that this FPGA model is contained in Tray. Fpga chips is designed wFpga chipsh 256 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 396288 bFpga chipss. Parts related to this part can be found using its base part number LFXP2-30. The RAM si48.4kBe of this FPGA module reaches 48.4kB so as to guarantee the normal operation of the program during operation. In this case, there are 256 pins on the board. A total of 3625 LABs/CLBs make up this FPGA array. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. In the case of 1.2V supply voltage, designers can take full advantage of its flexibility. This is a battery operated device that operates on 1.21.2/3.33.3V. A total of 256 pins are included in this device. Normally, fpga semiconductor uses an oscillator, which oscillates at 435MHz, to create the signal. Programs and data can be stored in the 55.4kB memory embedded in this FPGA module.
LFXP2-30E-7FTN256C Features
201 I/Os
Up to 396288 RAM bits
256 LABs/CLBs
LFXP2-30E-7FTN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-30E-7FTN256C FPGAs applications.
- Security systems
- Image processing
- Enterprise networking
- Telecommunication
- Digital signal processing
- Distributed Monetary Systems
- Military Temperature
- Automation
- DO-254
- Broadcast
