LFXP2-8E-6FTN256C
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | XP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP2-8 |
| Pin Count | 256 |
| Number of Outputs | 201 |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Memory Size | 29.9kB |
| Number of I/O | 201 |
| RAM Size | 27.6kB |
| Clock Frequency | 435MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 226304 |
| Number of LABs/CLBs | 1000 |
| Combinatorial Delay of a CLB-Max | 0.399 ns |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFXP2-8E-6FTN256C Overview
In the package 256-LBGA, this product is provided. There are FIELD PROGRAMMABLE GATE ARRAY transistors in this type of FPGA. A total of 201 I/Os are programmed to ensure a more coherent data transfer. The basic building blocks of logic contain 8000 logic elements/cells. Fpga chips is powered from a supply voltage of 1.2V. An FPGA part from the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. This device is powered by a 1.14V~1.26V battery. The FPGA belongs to the XP2 series of FPGAs, and it is one type of FPGA. Fpga chips is recommended that the operating temperature be kept wFpga chipshin the range 0°C~85°C TJ while the machine is operating. A total of 201 outputs are incorporated into this device. Using the Tray layout, this FPGA model can be contained in a very small amount of space. Fpga chips is designed wFpga chipsh 256 terminations. This device is equipped with 226304 RAM bits in terms of its RAM si226304e. Parts related to this part can be found using its base part number LFXP2-8. Fpga electronics is important that this FPGA module has a RAM si27.6kBe of 27.6kB in order to ensure that the program will run normally. The device has 256 pins which are included in the design. A total of 1000 LABs/CLBs are included in this FPGA. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. The 1.2V supply voltage provides designers with full flexibility in their designs. Powered by a 1.21.2/3.33.3V power supply, it can be operated by almost anyone. As far as the pin count is concerned, it has 256 pins. Most commonly, this device makes use of an oscillating crystal frequency of 435MHz to operate. Programs and data can be stored in the 29.9kB memory embedded in this FPGA module.
LFXP2-8E-6FTN256C Features
201 I/Os
Up to 226304 RAM bits
256 LABs/CLBs
LFXP2-8E-6FTN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-8E-6FTN256C FPGAs applications.
- DO-254
- Video & Image Processing
- Data center hardware accelerators
- Voice recognition
- Audio
- Automotive driver's assistance
- Server Applications
- Development Boards and Shields for Microcontrollers
- Software-defined radios
- Data Center
