LFXP2-8E-6FTN256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-LBGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | XP2 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP2-8 |
| Pin Count | 256 |
| Number of Outputs | 201 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Memory Size | 29.9kB |
| Number of I/O | 201 |
| RAM Size | 27.6kB |
| Clock Frequency | 435MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 226304 |
| Number of LABs/CLBs | 1000 |
| Combinatorial Delay of a CLB-Max | 0.399 ns |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
LFXP2-8E-6FTN256I Overview
As part of the 256-LBGA package, it is included. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. Having 201 I/Os makes data transfers more coherent. A fundamental building block is made up of 8000 logic elements/cells. 1.2V volts power it. This FPGA part belongs to the family of Field Programmable Gate Arrays. An attachment Surface Mount allows the FPGA module to be attached to the development board. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. The FPGA belongs to the XP2 series of FPGAs, and it is one type of FPGA. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, there are 201 outputs that can be used. This FPGA model is contained in Tray for space saving. In total, it has a total of 256 terminations. Having a RAM bit size of 226304 means that this device will offer you a lot of memory. If you are looking for related parts, you can use the base part number LFXP2-8 as a starting point. It is crucial that the RAM si27.6kBe of this FPGA module reaches 27.6kB so that the program can run normally. The device has 256 pins which are included in the design. Fpga electronics contains 1000 LABs/CLBs in an array. According to its specifications, this FPGA will be able to work fantastically as long as it is mounted in Surface Mount. A 1.2V-volt supply allows designers to fully utilize its flexibility. This is a battery operated device that operates on 1.21.2/3.33.3V. The device has a total of 256 pins on fpga semiconductor. Most commonly, this device makes use of an oscillating crystal frequency of 435MHz to operate. In this FPGA module, there is a memory of 29.9kB that can be used to store programs and data.
LFXP2-8E-6FTN256I Features
201 I/Os
Up to 226304 RAM bits
256 LABs/CLBs
LFXP2-8E-6FTN256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-8E-6FTN256I FPGAs applications.
- Data Mining
- Medical Electronics
- High Performance Computing
- Scientific Instruments
- Device controllers
- Electronic Warfare
- Artificial intelligence (AI)
- Data Center
- Automation
- Ecosystem
