Parameters |
Factory Lead Time |
1 Week |
Mount |
Surface Mount |
Mounting Type |
Surface Mount |
Package / Case |
256-LBGA |
Number of Pins |
256 |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
XP2 |
JESD-609 Code |
e1 |
Pbfree Code |
yes |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
256 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Voltage - Supply |
1.14V~1.26V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
40 |
Base Part Number |
LFXP2-8 |
Pin Count |
256 |
Number of Outputs |
201 |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1.2V |
Power Supplies |
1.21.2/3.33.3V |
Memory Size |
29.9kB |
Number of I/O |
201 |
RAM Size |
27.6kB |
Clock Frequency |
435MHz |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
8000 |
Total RAM Bits |
226304 |
Number of LABs/CLBs |
1000 |
Number of Logic Blocks (LABs) |
1500 |
Combinatorial Delay of a CLB-Max |
0.304 ns |
Height Seated (Max) |
2.1mm |
Length |
17mm |
Width |
17mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
LFXP2-8E-7FTN256C Overview
There are two packages that contain fpga chips: 256-LBGA package and X package. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. A total of 201 I/Os are programmed to ensure a more coherent data transfer. Logic blocks consist of 8000 logic elements/cells. In order to operate fpga chips, a voltage supply of 1.2V volts is required. An FPGA part from the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. Fpga chips operates wFpga chipsh a supply voltage of 1.14V~1.26V. It is a type of FPGA belonging to the XP2 seies. As far as the operating temperature is concerned, it should be kept within 0°C~85°C TJ when operating. During the installation of this device, 201 outputs were incorporated. As a result of space limitations, this FPGA model has been included in Tray. In total, it has 256 terminations on each end. This device is equipped with 226304 RAM bits in terms of its RAM si226304e. Parts related to this part can be found using its base part number LFXP2-8. The RAM si27.6kBe of this FPGA module reaches 27.6kB so as to guarantee the normal operation of the program during operation. In this case, 256 pins are used in the design. The FPGA consists of 1000 LABs/CLBs. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Its flexibility is fully utilized when operated with a supply voltage of 1.2V. Fpga electronics operates from a 1.21.2/3.33.3V power supply. This device has a pin count of 256 in fpga semiconductor. In its basic building block, it is composed of 1500 logic blocks (LABs), which are called building blocks. It usually uses a crystal oscillating at a frequency of 435MHz in order to do its work. For storing programs and data, this FPGA module embeds memory 29.9kB.
LFXP2-8E-7FTN256C Features
201 I/Os
Up to 226304 RAM bits
256 LABs/CLBs
1500 logic blocks (LABs)
LFXP2-8E-7FTN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-8E-7FTN256C FPGAs applications.
- Device controllers
- Secure Communication
- Wireless Communications
- Cryptography
- Software-defined radios
- Broadcast
- ASIC prototyping
- DO-254
- Space Applications
- Development Boards and Shields for Microcontrollers