LFXP2-8E-7M132C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 132-LFBGA, CSPBGA |
| Number of Pins | 132 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2013 |
| Series | XP2 |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 132 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.14V~1.26V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Base Part Number | LFXP2-8 |
| Pin Count | 132 |
| Number of Outputs | 86 |
| Operating Supply Voltage | 1.2V |
| Power Supplies | 1.21.2/3.33.3V |
| Memory Size | 29.9kB |
| Number of I/O | 86 |
| RAM Size | 27.6kB |
| Clock Frequency | 435MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 8000 |
| Total RAM Bits | 226304 |
| Number of LABs/CLBs | 1000 |
| Combinatorial Delay of a CLB-Max | 0.304 ns |
| Height Seated (Max) | 1.35mm |
| Length | 8mm |
| Width | 8mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Lead Free |
LFXP2-8E-7M132C Overview
A 132-LFBGA, CSPBGA package is provided with this component. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. A total of 86 I/Os are programmed to ensure a more coherent data transfer. Logic elements/cells form the fundamental building block of a computer. Power is provided by a 1.2V-volt supply. Field Programmable Gate Arrays family FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. Fpga chips operates at a voltage of 1.14V~1.26V and uses a battery to supply power. The XP2 series FPGA is a type of FPGA that belongs to the XP2 family of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~85°C TJ when the device is operating. In order to make this device as versatile as possible, there are 86 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. Total terminations are 132. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 226304 bFpga chipss. You can find related parts by using the part number LFXP2-8, which is its base part number. During the configuration of this FPGA module, the RAM si27.6kBe reaches 27.6kB to ensure that the program runs normally. There are 132 pins on this device. An array of 1000 LABs/CLBs is built into the FPGA. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. Design engineers can fully take advantage of its flexibility when operating at 1.2V supply voltage. There is a 1.21.2/3.33.3V power supply that is required to operate it. A total of 132 pins are included in this device. A crystal oscillating at 435MHz is one of the most common components of this device. This FPGA module embeds a memory of 29.9kB available for storing programs and data.
LFXP2-8E-7M132C Features
86 I/Os
Up to 226304 RAM bits
132 LABs/CLBs
LFXP2-8E-7M132C Applications
There are a lot of Lattice Semiconductor Corporation LFXP2-8E-7M132C FPGAs applications.
- Defense Applications
- Wireless Communications
- Voice recognition
- Data center hardware accelerators
- Development Boards and Shields for Microcontrollers
- Computer hardware emulation
- Data Center
- Solar Energy
- Broadcast
- Space Applications
