LFXP3C-3QN208C
| Parameters | |
|---|---|
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 208-BFQFP |
| Number of Pins | 208 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2000 |
| Series | XP |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 208 |
| ECCN Code | EAR99 |
| Terminal Finish | Matte Tin (Sn) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~3.465V |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.5mm |
| Frequency | 320MHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP3 |
| Pin Count | 208 |
| Number of Outputs | 136 |
| Operating Supply Voltage | 1.8V |
| Power Supplies | 1.8/2.5/3.3V |
| Memory Size | 8.3kB |
| Number of I/O | 136 |
| RAM Size | 6.8kB |
| Organization | 384 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 3000 |
| Total RAM Bits | 55296 |
| Combinatorial Delay of a CLB-Max | 0.63 ns |
| Number of CLBs | 384 |
| Number of Logic Cells | 384 |
| Height Seated (Max) | 4.1mm |
| Length | 28mm |
| Width | 28mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
LFXP3C-3QN208C Overview
This package is included in the 208-BFQFP package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. Its 136 I/Os help it transfer data more efficiently. A fundamental building block contains 3000 logic elements or cells. In order for the device to operate, a supply voltage of 1.8V volts needs to be provided. There is a Field Programmable Gate Arrays family component in this FPGA part. This FPGA module can be attached to the development board with a Surface Mount. There is a 1.71V~3.465V-volt supply voltage required for the device to operate. It is a type of FPGA belonging to the XP seies. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. In this device, 136 outputs are incorporated in order to provide you with maximum flexibility. There is an FPGA model contained in Tray in order to conserve space. Total terminations are 208. This device is equipped with 55296 RAM bits in terms of its RAM si55296e. Its base part number LFXP3 can be used to find parts that are related to it. There is a maximum RAM si6.8kBe of 6.8kB on this FPGA module, which is necessary to ensure the normal operation of the program. This cable has 208 pins and is designed to connect to a computer. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. Design engineers can fully take advantage of its flexibility when operating at 1.8V supply voltage. Power is supplied to the device by a 1.8/2.5/3.3V battery. Featuring 208 pins in total, it is a versatile device. This FPGA module embeds a memory of 8.3kB available for storing programs and data. A CLB is a basic module that determines the architecture of a system. A frequency of 320MHz provides high efficiency. As part of the building blocks, it consists of 384 logic cells.
LFXP3C-3QN208C Features
136 I/Os
Up to 55296 RAM bits
208 LABs/CLBs
Operating from a frequency of 320MHz
LFXP3C-3QN208C Applications
There are a lot of Lattice Semiconductor Corporation LFXP3C-3QN208C FPGAs applications.
- Wired Communications
- Automotive advanced driver assistance systems (ADAS)
- Software-defined radios
- Defense Applications
- Solar Energy
- Aerospace and Defense
- Industrial IoT
- Distributed Monetary Systems
- Development Boards and Shields for Microcontrollers
- Medical ultrasounds
