LFXP6C-3F256I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2008 |
| Series | XP |
| JESD-609 Code | e0 |
| Pbfree Code | no |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Lead (Sn63Pb37) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Frequency | 320MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | LFXP6 |
| Pin Count | 256 |
| Number of Outputs | 188 |
| Operating Supply Voltage | 1.8V |
| Power Supplies | 1.8/2.5/3.3V |
| Memory Size | 11.9kB |
| Number of I/O | 188 |
| RAM Size | 9kB |
| Organization | 720 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 6000 |
| Total RAM Bits | 73728 |
| Combinatorial Delay of a CLB-Max | 0.63 ns |
| Number of CLBs | 720 |
| Number of Logic Cells | 720 |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
| Lead Free | Lead Free |
LFXP6C-3F256I Overview
The package that contains this software is called 256-BGA. An FPGA of this type is made up of FIELD PROGRAMMABLE GATE ARRAY gates. Fpga chips is programmed wFpga chipsh 188 I/Os for transferring data in a more coherent manner. There are 6000 logic elements/cells to form a fundamental building block. 1.8V volts power it. FPGA parts like this belong to the Field Programmable Gate Arrays family. With a Surface Mount connector, this FPGA module can be attached to the development board. In order to operate it, it requires a voltage supply of 1.71V~3.465V . An FPGA belonging to the XP series is referred to as an FPGA. Operating temperatures should be maintained within the -40°C~100°C TJ range at all times when the unit is in use. There are 188 outputs incorporated in this device. A model of this FPGA is contained in Tray for the purpose of saving space. In total, there are a total of 256 terminations on fpga chips. Having a RAM bit size of 73728 means that this device will offer you a lot of memory. Related parts can be found by using its base part number LFXP6. It is crucial that the RAM si9kBe of this FPGA module reaches 9kB so that the program can run normally. In this case, 256 pins are used in the design. In order for this FPGA to work properly in accordance with its specifications, it is necessary that it is mounted in Surface Mount. With a 1.8V supply voltage, designers can fully utilize the flexibility of the device. The device runs on a 1.8/2.5/3.3V battery and requires no additional power supply to operate. There are a total of 256 pins on this device. For storing programs and data, this FPGA module embeds memory 11.9kB. 720 CLBs are basic modules used for its architecture. This device operates at a frequency of 320MHz in order to provide high efficiency. It incorporates 720 logic cells used for the building block.
LFXP6C-3F256I Features
188 I/Os
Up to 73728 RAM bits
256 LABs/CLBs
Operating from a frequency of 320MHz
LFXP6C-3F256I Applications
There are a lot of Lattice Semiconductor Corporation LFXP6C-3F256I FPGAs applications.
- Military DSP
- Scientific Instruments
- Camera time adjustments
- Data center hardware accelerators
- ADAS
- Consumer Electronics
- Telecommunication
- Automotive Applications
- Distributed Monetary Systems
- Wireless Communications
