LFXP6C-3FN256C
| Parameters | |
|---|---|
| Operating Supply Voltage | 1.8V |
| Power Supplies | 1.8/2.5/3.3V |
| Memory Size | 11.9kB |
| Number of I/O | 188 |
| RAM Size | 9kB |
| Organization | 720 CLBS |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 6000 |
| Total RAM Bits | 73728 |
| Combinatorial Delay of a CLB-Max | 0.63 ns |
| Number of CLBs | 720 |
| Number of Logic Cells | 720 |
| Height Seated (Max) | 2.1mm |
| Length | 17mm |
| Width | 17mm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Number of Pins | 256 |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2007 |
| Series | XP |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 1.71V~3.465V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 1mm |
| Frequency | 320MHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | LFXP6 |
| Pin Count | 256 |
| Number of Outputs | 188 |
LFXP6C-3FN256C Overview
In the 256-BGA package, you will find fpga chips. FPGAs of this type consist of FIELD PROGRAMMABLE GATE ARRAY components. There are 188 I/Os for better data transfer. There are 6000 logic elements/cells to form a fundamental building block. Fpga chips is powered from a supply voltage of 1.8V. In this case, the FPGA part belongs to the Field Programmable Gate Arrays family. FPGA modules can be attached to development boards using a Surface Mount-connector. With a supply voltage of 1.71V~3.465V, this device operates with ease. There are many types of FPGAs in the XP series, this is one of them. The operating temperature should be kept at 0°C~85°C TJ when operating. In order to make this device as versatile as possible, there are 188 different outputs included. Fpga chips is designed to maximiTraye space efficiency by containing the FPGA model in Tray. In total, it has 256 terminations on each end. The RAM bits that are offered by this fpga chips are 73728. In order to find related parts, use the part number LFXP6 as a base. During the configuration of this FPGA module, the RAM si9kBe reaches 9kB to ensure that the program runs normally. The device is designed with 256 pins in total. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. Designers can fully utilize its flexibility with 1.8V supply voltage. Power is supplied to the device by a 1.8/2.5/3.3V battery. This device has a pin count of 256 in fpga semiconductor. Data and programs can be stored in this FPGA module's memory of 11.9kB. For its architecture, 720 CLB modules are used. The system operates at a frequency of 320MHz in order to achieve maximum efficiency. For the building block of this system, 720 logic cells are included.
LFXP6C-3FN256C Features
188 I/Os
Up to 73728 RAM bits
256 LABs/CLBs
Operating from a frequency of 320MHz
LFXP6C-3FN256C Applications
There are a lot of Lattice Semiconductor Corporation LFXP6C-3FN256C FPGAs applications.
- Integrating multiple SPLDs
- Medical Applications
- Space Applications
- Automotive
- Embedded Vision
- Automotive advanced driver assistance systems (ADAS)
- Artificial intelligence (AI)
- Cryptography
- Telecommunication
- Wired Communications
