Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | DO-213AC, MINI-MELF, SOD-80 |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2017 |
Series | Automotive, AEC-Q101 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-LELF-R2 |
Operating Temperature (Max) | 175°C |
Number of Elements | 1 |
Configuration | SINGLE |
Power Dissipation-Max | 0.5W |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 50nA @ 50V |
Voltage - Forward (Vf) (Max) @ If | 1V @ 50mA |
Case Connection | ISOLATED |
Operating Temperature - Junction | 175°C Max |
Output Current-Max | 0.15A |
Voltage - DC Reverse (Vr) (Max) | 50V |
Max Reverse Voltage (DC) | 50V |
Average Rectified Current | 300mA |
Reverse Recovery Time | 4 ns |
Capacitance @ Vr, F | 2pF @ 0V 1MHz |
RoHS Status | ROHS3 Compliant |