Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mounting Type | Surface Mount |
Package / Case | 100-LQFP |
Surface Mount | YES |
Operating Temperature | -40°C~85°C TA |
Packaging | Tray |
Published | 2007 |
Series | LPC17xx |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 100 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) |
HTS Code | 8542.31.00.01 |
Subcategory | Microcontrollers |
Technology | CMOS |
Terminal Position | QUAD |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | 260 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.5mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | LPC1769 |
Pin Count | 100 |
JESD-30 Code | S-PQFP-G100 |
Qualification Status | Not Qualified |
Supply Voltage-Max (Vsup) | 3.6V |
Power Supplies | 3.3V |
Supply Voltage-Min (Vsup) | 2.4V |
Oscillator Type | Internal |
Number of I/O | 70 |
Speed | 120MHz |
RAM Size | 64K x 8 |
Voltage - Supply (Vcc/Vdd) | 2.4V~3.6V |
uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
Core Processor | ARM® Cortex®-M3 |
Peripherals | Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT |
Clock Frequency | 25MHz |
Program Memory Type | FLASH |
Core Size | 32-Bit |
Program Memory Size | 512KB 512K x 8 |
Connectivity | CANbus, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG |
Bit Size | 32 |
Data Converter | A/D 8x12b; D/A 1x10b |
Has ADC | YES |
DMA Channels | YES |
PWM Channels | YES |
DAC Channels | YES |
ROM (words) | 524288 |
Height Seated (Max) | 1.6mm |
Length | 14mm |
Width | 14mm |
RoHS Status | ROHS3 Compliant |
LPC1769FBD100,551 microcontroller features several devices featuring peripheral sets targeted for a large number of applications. LPC1769FBD100,551 datasheet is an excellent option for a variety of extensive hardware and software ecosystem. NXP USA Inc. LPC1769FBD100,551 is suitable for Smart Power Socket and Light Switch, Motorcycle Engine Control Unit, Input Device, Smart Watch, and Wireless Charging Pad.
For the purpose of saving space, it is available in the 100-LQFP package.In this case, it is mounted using the method of Surface Mount.It comes in the package of a Tray.A ARM? Cortex?-M3 core processor powers the device.In order to work effectively, the temperature should be kept at -40°C~85°C TA.FLASH has been assigned to it as a program memory.There are 70 I/Os on it, which makes it a very simple device.A comparable component can be found by using the base part number LPC1769.The terminals of this device are set to QUAD.A 100 termination is present.LPC17xx is the series number of this electrical component.By using a 3.3V voltage supply, high efficiency is possible.As for the uPs/uCs/peripheral ICs, this gadget has MICROCONTROLLER, RISC.Total number of pins is 100.In the subcategory of Microcontrollers, this component is included.Powered by a 3.3V source.There is a clock running in the device at a frequency of 25MHz.Normally, the supply voltage (Vsup) should remain above 2.4V.It works with an oscillator type Internal.
100-LQFP package
Mounting type of Surface Mount
Microcontrollers subcategory
There are a lot of NXP USA Inc. LPC1769FBD100,551 Microcontroller applications.
Refrigerators
Wastewater treatment
Medical instruments chromatographs
Calculator
Missile control
Broadband technology, video and voice processing
Industrial instrumentation devices
Electromechanical control
Paper shredders
Set-top boxes