Parameters |
Package / Case |
448-FBGA Exposed Pad |
Supplier Device Package |
448-PBGA w/Heat Spreader (23x23) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Published |
2014 |
Series |
QorlQ LS1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
650MHz |
Core Processor |
ARM1136JF-S |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
I2C, PCIe, PCM/TDM, SPI, UART |
RoHS Status |
ROHS3 Compliant |
LS101MASN7EHA Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 448-FBGA Exposed Pad. High reliability is achieved by using advanced packaging methods Tray. CPUs have 1 Core 32-Bit cores/bus width. Obtain a basic understanding of operating temperature around 0°C. This is part of the QorlQ LS1 series. ARM1136JF-S processors are embedded in this CPU. There are DDR2 RAM controllers on this CPU. With its I2C, PCIe, PCM/TDM, SPI, UART interfaces, this microprocessor will be able to serve you better. It is offered by suppliers as a package 448-PBGA w/Heat Spreader (23x23).
LS101MASN7EHA Features
ARM1136JF-S Core
LS101MASN7EHA Applications
There are a lot of NXP USA Inc. LS101MASN7EHA Microprocessor applications.
- Robotic prosthetic limbs
- Auto-breaking system
- Industrial control field
- Projector
- Mice
- Measuring revolving objects
- Set-top boxes
- ECG machine
- Refrigerators
- 3D printers